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cartreader/hardware/footprints/!OSCRMisc.pretty/IC - VSELECT - TPS2113.kicad_mod

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VSELECT Module Rev 3 Refreshed things a bit to improve clarity, make installation easier, and to reduce costs when manufacturing in bulk. There is no reason to upgrade already installed modules to this revision. * Changed the module to be installed on the back of the PCB again as it is much easier to install that way. * Added pad for the STAT pin. There's no real use for this at the moment. * Changed the layout slightly to allow room for all of the capacitors' legends. This should make things more clear when assembling a module by hand. * Changed the legends for the jumper pads to use the net name instead of the designator. This should make things easier during installation. * Added legends to specify 3.3V/5V for the pads that connect to the power switch footprint. Hopefully, this helps keep people from installing the module incorrectly. * Updated the TPS2113 footprint to the new one that allows using either the TSSOP or SON package. This should give more flexibility regarding part availability. * Changed part numbers to more readily available parts. This should reduce the cost of machine assembly.
2024-08-26 17:29:01 +02:00
(footprint "IC - VSELECT - TPS2113"
(version 20240108)
(generator "pcbnew")
(generator_version "8.0")
(layer "F.Cu")
(descr "Combination footprint supports 8-TSSOP and 8-SON; has paste only for 8-SON!")
(tags "TPS2113")
(property "Reference" "REF**"
(at 0 -1.7 0)
(layer "F.SilkS")
(uuid "b88a0179-0761-4be2-96b7-8c61f1f96e59")
(effects
(font
(size 0.5 0.5)
(thickness 0.12)
)
(justify bottom)
)
)
(property "Value" "TPS2113"
(at 0 1.6 0)
(layer "F.Fab")
(hide yes)
(uuid "06ebc777-3196-4aaf-bbe7-13efe7fdad77")
(effects
(font
(size 0.5 0.5)
(thickness 0.1)
)
)
)
(property "Footprint" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "3ef351ab-973f-4a0f-bed5-a8677d25a1c0")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "9ccfc8fe-ab64-4a24-9220-ab49938f01bd")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "38482317-8c00-445f-a32b-16a9f0ae6e2a")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(clearance 0.15)
(attr smd)
(fp_line
(start -1.9 -1.559999)
(end 1.45 -1.559999)
(stroke
(width 0.1)
(type default)
)
(layer "F.SilkS")
(uuid "08a1f8ac-6ee4-400e-a107-97b5e2e0b9f7")
)
(fp_line
(start -1.4 1.56)
(end 1.4 1.56)
(stroke
(width 0.1)
(type default)
)
(layer "F.SilkS")
(uuid "1cc6c8eb-057a-4b98-bb71-ad400f0224f5")
)
(fp_poly
(pts
(xy -3.049999 -1.5) (xy -3.289999 -1.83) (xy -2.809999 -1.83) (xy -3.049999 -1.5)
)
(stroke
(width 0.12)
(type solid)
)
(fill solid)
(layer "F.SilkS")
(uuid "90d02910-b0b5-455b-b9cf-79a5d97bd0e6")
)
(fp_line
(start -4.274999 -1.974996)
(end -4.274999 1.975002)
(stroke
(width 0.15)
(type solid)
)
(layer "F.CrtYd")
(uuid "ad3685e9-b74c-4c5d-91af-e408afcccd8b")
)
(fp_line
(start -4.274999 1.975002)
(end 4.275001 1.975002)
(stroke
(width 0.15)
(type solid)
)
(layer "F.CrtYd")
(uuid "87be0132-56c4-4a96-94b0-572eb7aeeacd")
)
(fp_line
(start 4.275001 -1.974996)
(end -4.274999 -1.974996)
(stroke
(width 0.15)
(type solid)
)
(layer "F.CrtYd")
(uuid "c14ed152-172c-423f-8883-5491ac43e712")
)
(fp_line
(start 4.275001 -1.974996)
(end 4.275001 -1.974996)
(stroke
(width 0.15)
(type solid)
)
(layer "F.CrtYd")
(uuid "ad17112a-a282-4d03-9599-e5071930fd52")
)
(fp_line
(start 4.275001 1.975002)
(end 4.275001 -1.974996)
(stroke
(width 0.15)
(type solid)
)
(layer "F.CrtYd")
(uuid "e2284efd-d624-4d28-a16f-258f233bb4d0")
)
(fp_line
(start -2.249998 -1.549999)
(end 2.250001 -1.549999)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "cf795279-a1c3-4f8e-8ee6-c18fb6e4022e")
)
(fp_line
(start -2.249998 1.549999)
(end -2.249998 -1.549999)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "a5ee63ff-b116-48bd-9f0b-9a0f0351ba21")
)
(fp_line
(start -2.249998 1.549999)
(end 2.250001 1.549999)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "083e42b3-9708-45fd-8a79-c4bfdebafc6e")
)
(fp_line
(start -1.5 -0.45)
(end -1 -0.95)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "5646e25c-d36f-4b3f-8c17-e7d606ab68ee")
)
(fp_line
(start -1.5 1.05)
(end -1.5 -0.45)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "0cb38e21-0942-4639-b1e4-c1c547ef99c2")
)
(fp_line
(start -1 -0.95)
(end 1.5 -0.95)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "140c2234-00e5-41fc-aa35-2e83495cf582")
)
(fp_line
(start 1.5 -0.95)
(end 1.5 1.05)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "3aa39632-a4f3-44e0-9af6-65a39825bcb7")
)
(fp_line
(start 1.5 1.05)
(end -1.5 1.05)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "d637cbcc-1ebf-4cc4-a681-de3ee58fd49f")
)
(fp_line
(start 2.250001 1.549999)
(end 2.250001 -1.549999)
(stroke
(width 0.1)
(type solid)
)
(layer "F.Fab")
(uuid "e58b3075-2f37-49c9-a05d-efca560b6aaa")
)
(fp_circle
(center -1.35 -0.649999)
(end -0.850001 -0.649999)
(stroke
(width 0.1)
(type solid)
)
(fill none)
(layer "F.Fab")
(uuid "39c76878-2dab-4c60-b192-dd619b9adad7")
)
(fp_text_box "*** NOTICE ***\nSolder paste has been added for the 8-SON package only. If using the 8-TSSOP package for machine assembly or with a stencil you must edit the pads and enable the solder paste layer for the 8-TSSOP as well as disable it for the 8-SON pads."
(start -4.3 2.1)
(end 4.3 4.3)
(layer "Cmts.User")
(uuid "8bc7aa09-7521-4ccd-aea3-531f96869560")
(effects
(font
(size 0.2 0.2)
(thickness 0.03175)
)
(justify top)
)
(border yes)
(stroke
(width 0.03175)
(type dot)
)
)
(pad "" smd roundrect
(at 0 -0.63)
(size 1.47 1.06)
(layers "F.Paste")
(roundrect_rratio 0.04716981132)
(uuid "30fe792c-f94a-45c1-a54a-64c7a1b14ae4")
)
(pad "" smd roundrect
(at 0 0.63)
(size 1.47 1.06)
(layers "F.Paste")
(roundrect_rratio 0.04716981132)
(uuid "c22ac406-1ad9-4a41-9758-aca31eb2dc2e")
)
(pad "1" smd roundrect
(at -3.049999 -0.974999 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "d256954f-70fb-494c-81c8-a5f244595343")
)
(pad "1" smd roundrect
(at -1.3975 -0.98)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(uuid "fa06c472-f92f-4c1e-929f-f77349ea0fc3")
)
(pad "2" smd roundrect
(at -3.049999 -0.324998 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "b41b859e-a101-4f5b-86a9-b615346717ab")
)
(pad "2" smd roundrect
(at -1.3975 -0.33)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(thermal_bridge_width 0.2)
(thermal_gap 0.15)
(uuid "9d7a0234-f48e-43a7-8d8e-1771318f9f08")
)
(pad "3" smd roundrect
(at -3.049999 0.325001 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "3786d78b-61c5-44d8-829e-cfba0c4be785")
)
(pad "3" smd roundrect
(at -1.3975 0.32)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(uuid "a8888280-162c-458f-a00b-2f36593c3fa5")
)
(pad "4" smd roundrect
(at -3.049999 0.975002 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "34947aeb-958c-44f8-a866-c34e8483c279")
)
(pad "4" smd roundrect
(at -1.3975 0.97)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(uuid "a98fffc4-d374-4da8-9047-36ce40640094")
)
(pad "5" smd roundrect
(at 1.4025 0.97)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(thermal_bridge_width 0.2)
(thermal_gap 0.15)
(uuid "361c2713-c195-455b-ae37-5c7485d7fd28")
)
(pad "5" smd roundrect
(at 3.050002 0.975002 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "505b3364-2156-4dcd-9c03-00379635931a")
)
(pad "6" smd roundrect
(at 1.4025 0.32)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(uuid "2dd85cb1-e369-4997-b2d8-eecb0b14269e")
)
(pad "6" smd roundrect
(at 3.050002 0.325001 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "809def39-07a8-48db-997f-9bf556e23926")
)
(pad "7" smd roundrect
(at 1.4025 -0.33)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(uuid "529bbc54-c373-4b88-9cf2-0ae501d108d1")
)
(pad "7" smd roundrect
(at 3.050002 -0.324998 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "d6f11747-ef29-4700-8968-5a69d977c61d")
)
(pad "8" smd roundrect
(at 1.4025 -0.98)
(size 0.6 0.3)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.1666666667)
(solder_mask_margin 0.07)
(uuid "74ab520a-fa20-43ad-b91f-57b0c50830d8")
)
(pad "8" smd roundrect
(at 3.050002 -0.974999 270)
(size 0.45 1.6)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.111111358)
(uuid "1178c938-7563-444a-8d90-506b7ef62a95")
)
(pad "9" thru_hole circle
(at -0.575 0)
(size 0.4 0.4)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu" "*.Mask")
(remove_unused_layers no)
(thermal_bridge_width 0.2)
(thermal_gap 0.12)
(uuid "a0bd05f4-1b9e-430c-afb3-351dfddc04ee")
)
(pad "9" thru_hole circle
(at 0 -0.95)
(size 0.4 0.4)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu" "*.Mask")
(remove_unused_layers no)
(thermal_bridge_width 0.2)
(thermal_gap 0.12)
(uuid "a11bd611-37a7-492e-beda-b8c395da6037")
)
(pad "9" smd roundrect
(at 0 0)
(size 1.6 2.4)
(property pad_prop_heatsink)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.03125)
(solder_mask_margin 0.07)
(thermal_bridge_width 0.4)
(thermal_gap 0.2)
(uuid "06803922-4635-4680-96c6-5c6d919714de")
)
(pad "9" thru_hole circle
(at 0 0.95)
(size 0.4 0.4)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu" "*.Mask")
(remove_unused_layers no)
(thermal_bridge_width 0.2)
(thermal_gap 0.12)
(uuid "c5eda055-b8ff-4d4b-9902-ba7283d2018c")
)
(pad "9" thru_hole circle
(at 0.575 0)
(size 0.4 0.4)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu" "*.Mask")
(remove_unused_layers no)
(thermal_bridge_width 0.2)
(thermal_gap 0.12)
(uuid "b0332c6f-7e75-4f26-b7a4-016c37df7240")
)
(model "${KICAD7_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-8_4.4x3mm_P0.65mm.step"
(hide yes)
(offset
(xyz 0 0 0)
)
(scale
(xyz 1 1 1)
)
(rotate
(xyz 0 0 0)
)
)
(model "${KIPRJMOD}/../footprints/!OSCR.3dshapes/TPS2113ADRBR-1.step"
(hide yes)
(offset
(xyz 0 0 0)
)
(scale
(xyz 1 1 1)
)
(rotate
(xyz 0 0 0)
)
)
(model "${KIPRJMOD}/../footprints/!OSCR.3dshapes/TPS2113ADRBR-0.step"
(offset
(xyz 0 0 0)
)
(scale
(xyz 1 1 1)
)
(rotate
(xyz -90 0 0)
)
)
)
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