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- Have individual makefiles for different boot files - R4iTT: ARM9 entry 0x02000800 - Amaze3DS: ARM9 entry 0x02000000 - EDGEi: Same as R4iTT, but renamed to `dsedgei.dat` - Include each makefile from individual folders, copy needed things and zip
26 lines
726 B
Makefile
26 lines
726 B
Makefile
.PHONY: package
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export TOPDIR := $(shell pwd $(CURDIR))
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export BASE := $(shell basename $(CURDIR))
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export OUT := $(TOPDIR)/../../out
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export COMMON := $(TOPDIR)/../../common-kernels
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package: directory r4isdhc.hk_Dual-Core_pre-2019_BL2CK_1.30.4.zip r4isdhc.hk_Silver_RTS_Lite_pre-2019_BL2CK_1.30.4.zip old extdata
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directory:
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mkdir -p $(OUT)/$(BASE)
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include $(COMMON)/BL2CK/R4iTT/Makefile
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r4isdhc.hk_Dual-Core_pre-2019_BL2CK_1.30.4.zip: BL2CK_1.30.4.zip
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mv $(OUT)/$(BASE)/$< $(OUT)/$(BASE)/$@
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r4isdhc.hk_Silver_RTS_Lite_pre-2019_BL2CK_1.30.4.zip: BL2CK_1.30.4.zip
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mv $(OUT)/$(BASE)/$< $(OUT)/$(BASE)/$@
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old: directory
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make -C $@
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extdata: directory
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cp -r r4isdhc.hk_2014-2017_FWUpdate* README.txt $(OUT)/$(BASE)
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