Added support for the Hudson Soft Bee Pack and Bee Cards.
Requires a Hudson Soft Bee Pack inserted into the MSX Adapter.
Be sure to fully insert the Bee Card into the Bee Pack.
Select Mapper 14 "Hudson Soft Bee Pack" and set the ROM size (16K/32K).
Added support for new Flash chips - MX25L4005 and MX25L6405.
The new chips were found in cart with PCB B1043-03B.
Removed the ROM size selection as we detect the ROM size based on the Flash ID.
- Moved code to retrieve the cart name earlier and possibly rely on it to identify a game instead of game ID + CRC
- Moved code to regroup the different game checks
- Some comments and conditions get reduced
* Fixed the field name for the LCSC part number so the BOM exports with the part numbers.
* Removed the test points from the schematic as they are no longer needed.
* Added notes for setting the ILIM resistor to the schematic.
* Added an image of the PCB and PDF of the schematic.
Note: The PCB itself didn't change, so it is still Rev 3.
Refreshed things a bit to improve clarity, make installation easier, and to reduce costs when manufacturing in bulk. There is no reason to upgrade already installed modules to this revision.
* Changed the module to be installed on the back of the PCB again as it is much easier to install that way.
* Added pad for the STAT pin. There's no real use for this at the moment.
* Changed the layout slightly to allow room for all of the capacitors' legends. This should make things more clear when assembling a module by hand.
* Changed the legends for the jumper pads to use the net name instead of the designator. This should make things easier during installation.
* Added legends to specify 3.3V/5V for the pads that connect to the power switch footprint. Hopefully, this helps keep people from installing the module incorrectly.
* Updated the TPS2113 footprint to the new one that allows using either the TSSOP or SON package. This should give more flexibility regarding part availability.
* Changed part numbers to more readily available parts. This should reduce the cost of machine assembly.
